JPH0129070B2 - - Google Patents
Info
- Publication number
- JPH0129070B2 JPH0129070B2 JP57149334A JP14933482A JPH0129070B2 JP H0129070 B2 JPH0129070 B2 JP H0129070B2 JP 57149334 A JP57149334 A JP 57149334A JP 14933482 A JP14933482 A JP 14933482A JP H0129070 B2 JPH0129070 B2 JP H0129070B2
- Authority
- JP
- Japan
- Prior art keywords
- glass tube
- stepped cylindrical
- chip
- cylindrical electrode
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57149334A JPS5940555A (ja) | 1982-08-30 | 1982-08-30 | 電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57149334A JPS5940555A (ja) | 1982-08-30 | 1982-08-30 | 電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5940555A JPS5940555A (ja) | 1984-03-06 |
| JPH0129070B2 true JPH0129070B2 (en]) | 1989-06-07 |
Family
ID=15472831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57149334A Granted JPS5940555A (ja) | 1982-08-30 | 1982-08-30 | 電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5940555A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201945U (en]) * | 1986-06-12 | 1987-12-23 |
-
1982
- 1982-08-30 JP JP57149334A patent/JPS5940555A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5940555A (ja) | 1984-03-06 |
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